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High performance para-aramid paper

Heat-Resistant HP-Aramid-Paper

Para-aramid paper is a 100% para‑aramid high-performance material, produced via wet papermaking and hot-press forming, using para-aramid nanofibers as the matrix and chopped fibers as reinforcement.

Its aramid honeycomb features high specific stiffness and strength, excellent flame retardancy and thermal insulation. It is 20% lighter than meta‑aramid honeycomb at the same strength, ideal for lightweight, high-strength, flame-retardant and heat-insulating applications in aerospace, rail transit and other fields. 

Core Advantages

Maintains stable performance under high-temperature and harsh conditions
Maintains stable performance under high-temperature and harsh conditions
Offers reliable electrical insulation for high-end electronic devices
Adapts to aerospace, electrical engineering and precision equipment scenarios
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Technical Details

01
Advantage

Lightweight Components

25% lighter bulk density than meta-aramid paper honeycomb (e.g., 1mil paper), with broad prospects in low-altitude economy applications.

02
Advantage

High Load-Bearing Capacity

Higher specific strength and specific stiffness than meta-aramid honeycomb, suitable for structural parts in aviation and rail transit.

03
Advantage

Excellent Dimensional Stability

Moisture regain is 50% of meta-aramid honeycomb, and thermal expansion coefficient is only 25% of meta-aramid honeycomb.

04
Advantage

High Temperature Resistance

Decomposition temperature ~550℃, dimensional change rate ＜0.05% after 40min at 300℃, ensuring high-temperature stability.

Composition
100% Para-aramid
Weight reduction effect
25% lighter than meta-aramid honeycomb (20% lighter at equal strength)
Decomposition temperature
Approximately 550℃
Dimensional change rate (300℃/40min)
＜0.05%
Moisture regain
50% of meta-aramid honeycomb
Coefficient of thermal expansion
25% of meta-aramid honeycomb
Low-Altitude Economy

Low-Altitude Economy

Aerospace

Aerospace

Rail Transit

Rail Transit

Jufang New Materials

Founded in July 2018, it is a high-performance new material enterprise jointly established by Shandong Kingboard Holdings Group and Tsinghua University. Relying on a R&D team composed of master's and doctoral degree holders and Tsinghua University's technological advantages, it is deeply engaged in high-performance para-aramid new materials, focusing on the innovation of products and applications such as para-aramid nanofibers and aramid paper. These products are applied in key fields such as aerospace, supporting the demand for high-end materials.

Para-aramid nanofibers Aramid paper Aerospace
Qianbolun®
R&D Strength
Scientific research facilities

Relying on chambroad Group's 20,000㎡ scientific research and experiment building, 6,804.7㎡ pilot test building, 5,000㎡ technology achievement transformation base, and its own 810㎡ laboratory and analysis and testing center;

University-enterprise cooperation and R&D investment

Cooperates with universities such as Tsinghua University, Ocean University of China, and Shandong University; Annual R&D expenditure exceeds 10 million yuan.

Technological achievements

It has broken through multiple key technologies and applied for more than 20 invention patents and standards.

Global Layout
Preparing to expand into overseas markets

Preparing to expand into overseas markets

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